| Features | Capability |
| Types of PCB | Rigid, flex, and rigid-flex boards |
| PCB application features | Conventional PCB/High-density interconnect (HDI) /High heat dissipation PCB/high-frequency PCB |
| PCB materials | RR-4,Aluminum-Core,Copper-Core,RF PCB(Teflon,Polyimide,PTFE) |
| PCB Drilling | Blind, buried, and stacked vias |
| Layer count | 1 – 32 layers |
| size range | • Maximum Dimensions: |
| FR4 PCB: 670 × 600 mm | |
| Rogers / PTFE Teflon PCB: 590 × 438 mm | |
| Aluminum PCB: 602 × 506 mm | |
| Copper PCB: 480 × 286 mm | |
| • Minimum Dimensions | |
| Regular: 3 × 3 mm. | |
| Castellated / Plated Edges: 10 × 10 mm. | |
| track width and spacing | Min:1.5-mil |
| Impedance Tolerance | -/+ 5% Impedance Tolerance |
| Certifications | class 3 / ITAR registration / medical |
| Turn times | as fast as 1 day |
| Features | Capability |
| Quality Standard | IPC-A-610 |
| Assembly Technology | SMT / DIP / Conformal Coating |
| SMT assembly | single and double-sided surface mount assembly |
| Mixed assembly | SMT, through-hole, electro-mechanical assembly |
| Enterprise Certification | ISO9001 ISO13485 ISO14001 |
| Product Certification | UL RoHS SGS REACH |
| SMD Capability | Support: 01005, 0.3*0.15mm~200*125mm, BGA/CSP Minimum Ball Pitch: 0.15mm, 0.30mm, QFN, CSP, CON, etc. |
| Limit PCB Size for Standard: 70x70mm - 460x500mm, Limit PCB Size for Sampling:10x10mm - 470x500mm |
|
| Value-added features | Components Sourcing |
| NPI Report | |
| DFM Manufacturability Inspection | |
| PCBA Prototype | |
| IC Programming | |
| Material | RoHS, leaded, indium, clean and no clean chemistries |
| Cleaning | De-ionized water cleaning of assembled boards |
| Damp-proof process | ▪ Conformal Coating ▪ Nanocoating ▪ Low-pressure injection molding |
| Order capability | Order from 2 pieces |
| Time: | prototype:2 days batch:5-8 days |
| Features | Capability |
| BOM Health Review | Identifies problematic components such as Obsolete, End-of-Life, Not Recommended for New Design, Single Source, as well as the years before to End-of-life information of the components. |
| Component Alternate Sourcing & BOM Cost Reduction | Propose alternates for Single Source, Obsolete, End-Of-life Optimize BOM and provide significant Cost Savings for existing Product Design and New Product Development |
| Obsolescence Management & Component Availability | Monitor Product Change Notification and Component lifecycle (Obsolescence, End-of-life and component changes), providing the customers first hand information about the changes affecting their BO |
| Environmental Compliance | Ensures product complies with the latest and updated Environmental Compliance Directive, such as ROHS and REACH and other applicable directives. |
| Component Collaboration Options | Full turnkey options, as well as consigned and partially-consigned assembly |
| Component replacement plan | If we cannot source a specific component for your build, our engineers will make recommendations for fair-price alternatives so you can prototype with velocity. |
| Features | Capability |
| Items | AOI (Auto Optical Inspection) |
| X-ray test | |
| SPI (Solder Paste Inspection) | |
| FAI (First Article Inspection) | |
| FCT (Function Testing) | |
| ICT (In-Circuit Test) | |
| Aging test | |
| QC Manual detection |
|
Capability | |
| Items | HMIs | |
| housings | ||
| harness connectors | ||
| other modules |
